Intel’s two new Lakefield chips include the 1.4GHz Core i5-L16G7 and the 0.8GHz Core i3-L13G4, each with a TDP of 7W. Intel says the Intel Core processor with Intel Hybrid Technology will be ...

Intel pegged late 2019 to ship its Lakefield technology, which stacks Sunny Cove and Atom CPUs to share the processing load. We expect it to be used for thin-and-light laptops.

Intel must be feeling the heat from Qualcomm Snapdragon-powered laptops, because the company is now developing its first hybrid processor or system-on-a-chip (SOC). Then there’s Intel Lakefield ...

Intel is formally debuting its first Lakefield chips, featuring a hybrid core approach that merges its Core and Atom chips into a single design, along with a new stacked Foveros 3D design, which ...

After years of anticipation, Intel is officially launching its Lakefield mobile processors today, its first chips to combine its Core i3 and i5 hardware together with low-power "Tremont" Atom cores.

Intel has offered a glimpse at how it overcame those challenges in Lakefield, if not the whole picture. Every part of the stack gets vetted before assembly, for instance, to weed out any bad ...

Today, Intel fully unveiled its Lakefield processors, which are meant for dual-screen and foldable PCs. Similar to ARM processors, they have big and little cores for better power management.

When Intel launched Lakefield back in June 2020, it felt like the beginning of something new. ARM may have deployed big.Little a decade ago, but Intel and AMD had previously stuck to multi-core ...

Intel Unveils Lakefield CPU Specifications: Up to 3GHz, 64 EUs, and 7W TDP Intel Shares New Data on Lakefield’s Low-Power Tremont Microarchitecture Intel Uses New Foveros 3D Chip-Stacking to ...

Intel is previewing its upcoming Lakefield mobile processors in a new YouTube clip. This will be the first Intel chip to sport the new Foveros packaging technology, and will definitely DEFINITELY ...

Intel's new hybrid processors, Intel Lakefield, have launched today, promising smaller and more flexible chips for ultraportables, folding form-factors, and more. Announced first at CES 2020 back ...