Infineon has introduced Q-DPAK and TOLL package options to its lineup of 650-V CoolSiC Generation 2 (G2) MOSFETs. Leveraging G2 technology, these devices enable faster switching and lower power losses ...

Infineon Technologies has announced the launch of its CoolSET System in Package (SiP). CoolSET System in Package (SiP) Credit: Infineon A compact, fully integrated system power controller for highly ...

has announced the addition of the "Infineon EWLP Package Reverse Costing" report to their offering. The First Reverse Analysis Report of a Fan-out Wafer Level Package! This report is a reverse ...

Infineon has unveiled its latest Thin-TOLL 8x8 and TOLT packages. These cutting-edge solutions optimise space on circuit boards and enhance heat dissipation, making them ideal for a wide range of ...

These components use the latest SiGe:C HBT technology from Infineon and an effective eWLB / Fan-Out package. The two RF dies are packaged in the last version of the eWLB, the Fan-Out Wafer level ...

The source-down mosfet is on the right, and the more conventional device on the left. According to Infineon: The source-down package (1) is externally the same as the (2) conventional drain-down 3.3 x ...

Infineon Technologies has expanded its CoolSiC 1200 V and 2000 V MOSFET module families with a new industry-standard package. The 62mm device is designed in half-bridge topology and is based on the ...

Infineon Technologies AG today introduced an ultra-small plastic packaging technology that it said consumes only 20% the space of a standard SC-75 package. The Thin Small Leadless Package is targeted ...

Infineon Technologies has launched the IRPS5401, a five-output point of load (POL) digital voltage regulator for FPGAs, ASICs, and other multi-rail power systems. The IRPS5401has been developed as ...

In fact, every new car worldwide contains on average five sensors from Infineon supporting safety applications. Package, Price and Availability The SP35 Tire Pressure Sensor is packaged in a P ...