Infineon has introduced Q-DPAK and TOLL package options to its lineup of 650-V CoolSiC Generation 2 (G2) MOSFETs. Leveraging G2 technology, these devices enable faster switching and lower power losses ...

Infineon Technologies has announced the launch of its CoolSET System in Package (SiP). CoolSET System in Package (SiP) Credit: Infineon A compact, fully integrated system power controller for highly ...

has announced the addition of the "Infineon EWLP Package Reverse Costing" report to their offering. The First Reverse Analysis Report of a Fan-out Wafer Level Package! This report is a reverse ...

Infineon has unveiled its latest Thin-TOLL 8x8 and TOLT packages. These cutting-edge solutions optimise space on circuit boards and enhance heat dissipation, making them ideal for a wide range of ...

These components use the latest SiGe:C HBT technology from Infineon and an effective eWLB / Fan-Out package. The two RF dies are packaged in the last version of the eWLB, the Fan-Out Wafer level ...

Infineon is developing TRENCHSTOP H7 IGBTs in a DTO247 package, which is twice the size of a standard TO247. A single high-current IGBT in a DTO247 can replace multiple lower-current TO247 IGBTs ...

Infineon Technologies has expanded its CoolSiC 1200 V and 2000 V MOSFET module families with a new industry-standard package. The 62mm device is designed in half-bridge topology and is based on the ...

Infineon is sampling an IGBT package which can hold an IGBT up to 120A and a full rated diode in the same footprint and pin-out as JEDEC standard TO-247-3. Volume production is planned for Q1 2015.

Infineon Technologies has launched the IRPS5401, a five-output point of load (POL) digital voltage regulator for FPGAs, ASICs, and other multi-rail power systems. The IRPS5401has been developed as ...

In fact, every new car worldwide contains on average five sensors from Infineon supporting safety applications. Package, Price and Availability The SP35 Tire Pressure Sensor is packaged in a P ...

NEW DELHI: Continental Device India Limited (CDIL) Semiconductors and Infineon Technologies Asia Pacific, a power systems and Internet of Things (IoT) manufacturer, have partnered to package ...