the HybridPACK DC6i. This six pack module combines Infineon’s established EDT2 IGBTs with package technologies for compactness, improved thermal management at reduced material cost, and is ...

This six-pack module, aimed at hybrid and small battery electric vehicles, combines the company’s EDT2 IGBTs with package ... Within Infineon’s portfolio, the HybridPACK DC6i is positioned ...

Infineon has introduced Q-DPAK and TOLL package options to its lineup of 650-V CoolSiC Generation 2 (G2) MOSFETs. Leveraging G2 technology, these devices enable faster switching and lower power losses ...

Infineon has introduced the new TO-Leadless package for its power semiconductor devices in the current range of 300 Amperes. TO-Leadless package offers less package resistance and smaller size and ...

Infineon has unveiled its latest Thin-TOLL 8x8 and TOLT packages. These cutting-edge solutions optimise space on circuit boards and enhance heat dissipation, making them ideal for a wide range of ...

has announced the addition of the "Infineon EWLP Package Reverse Costing" report to their offering. The First Reverse Analysis Report of a Fan-out Wafer Level Package! This report is a reverse ...