Infineon has introduced Q-DPAK and TOLL package options to its lineup of 650-V CoolSiC Generation 2 (G2) MOSFETs. Leveraging G2 technology, these devices enable faster switching and lower power losses ...

Infineon Technologies has announced the launch of its CoolSET System in Package (SiP). CoolSET System in Package (SiP) Credit: Infineon A compact, fully integrated system power controller for highly ...

Aimed at the nascent market for what is being touted as a true universal DSL standard, the multichip package combines all the major components for a line card minus the crystal, said Ben Runyan, ...

has announced the addition of the "Infineon EWLP Package Reverse Costing" report to their offering. The First Reverse Analysis Report of a Fan-out Wafer Level Package! This report is a reverse ...

Infineon has unveiled its latest Thin-TOLL 8x8 and TOLT packages. These cutting-edge solutions optimise space on circuit boards and enhance heat dissipation, making them ideal for a wide range of ...

DrBlade from Infineon Technologies AG is reportedly t he first integrated DC/DC driver and MOSFET VR power stage implemented in an innovative chip-embedded package technology. DrBlade contains the ...

Infineon Technologies has expanded its CoolSiC 1200 V and 2000 V MOSFET module families with a new industry-standard package. The 62mm device is designed in half-bridge topology and is based on the ...

NEW DELHI: Continental Device India Limited (CDIL) Semiconductors and Infineon Technologies Asia Pacific, a power systems and Internet of Things (IoT) manufacturer, have partnered to package ...

The European Commission (EC) has approved a €920 million ($964m) funding package to support the construction of Infineon’s new chip fab in Dresden, Germany. The funding will allow the German chipmaker ...