Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques that the ...

Glass substrates, long viewed as a promising next-generation component in advanced chip packaging, are now nearing real-world ...

According to Etnews, Samsung is preparing for the future semiconductor market and plans to introduce glass substrates to improve packaging. This can be done by replacing Silicon interposers with Glass ...

STMicroelectronics has released a set of antenna-matching companion chips for STM32WL33 wireless microcontrollers (MCUs) to ...

are another integral component of advanced chip packages. Unlike main glass core substrates, these will continue to use organic dielectric materials and copper; only this time, they will be ...

The use of glass interposers instead of silicon could help Samsung cut production costs while offering more powerful AI chips ...

STMicroelectronics has released a set of antenna-matching companion chips for STM32WL33 wireless microcontrollers (MCUs) to ...

This is because glass substrates for now only seem to be really beneficial for big, multi-chip packages. While AMD's all for chiplet designs in its gaming processors, it will probably make more ...

WILMINGTON, Mass.--(BUSINESS WIRE)--Onto Innovation Inc. (NYSE: ONTO) today announced Onto Innovation’s glass substrate suite featuring the JetStep ® X500 panel-level packaging lithography ...

In October 2023, 123 years after Toppan Printing was founded in Tokyo in 1900, the group was reorganized into a holding company structure with Toppan Inc. as the core operating company. Based on a ...