To this end, glass substrates have emerged as a promising alternative with distinct benefits for semiconductor packaging. Glass is potentially an important material in electronic packaging due to its ...

TASMIT aims to supply the large glass substrate inspection system to manufacturers ... chips and a higher number of chips per package due to greater integration. As a result, interposers, which ...

Intel, for one, believes glass substrates are the future of multi-die processor packages, and that's perhaps a big reason why Absolics is investing in them. Absolics' parent is a subsidiary of the ...

Saturday 8 February 2025 Samsung denies claims of boosting its glass substrate supply chain to win AI chip clients Amid intensifying competition in advanced semiconductor packaging, Samsung ...

Onto Innovation and LPKF are set to accelerate mass production of glass core substrates for semiconductors LPKF joins Onto Innovation’s Packaging Applications Center of Excellence (PACE) Collaborating ...

However, compared to wafers, large glass panels warp significantly and are difficult to transfer, and require larger heaters to heat the panels. There were thus issues with heat control within system ...

C&G Hi Tech, a semiconductor equipment corporation participating in the 'Semicon Korea 2025' exhibition, noted that its glass substrate prototypes received significant interest from global ...

Saturday 8 February 2025 Samsung denies claims of boosting its glass substrate supply chain to win AI chip clients Amid intensifying competition in advanced semiconductor packaging, Samsung ...