Intel has been prototyping glass substrate tech for a decade or more. From the 1970s to 1990s, early microprocessors used lead frame wire packages. Then the industry made a transition to ceramic ...

Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques that the ...

Glass substrates, long viewed as a promising next-generation component in advanced chip packaging, are now nearing real-world ...

According to Etnews, Samsung is preparing for the future semiconductor market and plans to introduce glass substrates to improve packaging. This can be done by replacing Silicon interposers with Glass ...

are another integral component of advanced chip packages. Unlike main glass core substrates, these will continue to use organic dielectric materials and copper; only this time, they will be ...

The use of glass interposers instead of silicon could help Samsung cut production costs while offering more powerful AI chips ...

Saturday 8 February 2025 Samsung denies claims of boosting its glass substrate supply chain to win AI chip clients Amid intensifying competition in advanced semiconductor packaging, Samsung ...

This is because glass substrates for now only seem to be really beneficial for big, multi-chip packages. While AMD's all for chiplet designs in its gaming processors, it will probably make more ...

STMicroelectronics has released a set of antenna-matching companion chips for STM32WL33 wireless microcontrollers (MCUs) to ...

WILMINGTON, Mass.--(BUSINESS WIRE)--Onto Innovation Inc. (NYSE: ONTO) today announced Onto Innovation’s glass substrate suite featuring the JetStep ® X500 panel-level packaging lithography ...