Employing more stress testing at the wafer level improves quality while reducing burn-in time and cost. So why isn’t it ...

A new technical paper titled “Defect Analysis and Built-In-Self-Test for Chiplet Interconnects in Fan-out Wafer-Level Packaging” was published by researchers at Arizona State University. Abstract “Fan ...

The Fan-Out Wafer Level Packaging (FO-WLP) market is experiencing significant growth, driven by the increasing demand for smaller, more efficient semiconductor devices.

FREMONT, Calif., Dec. 16, 2024 /PRNewswire/ -- YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging today announced that SkyWater ...

Our high-power FOX-XP multi-wafer system and proprietary WaferPak Contactor offer a scalable, cost-effective manufacturing solution for testing and burn-in of AI processors at wafer level ...

Aehr is now the only company offering both wafer-level and package-level test and burn-in solutions for AI processors. Gayn Erickson, President and CEO of Aehr Test Systems remarked: ...

TEMPE, Ariz., March 19, 2024 (GLOBE NEWSWIRE) -- Arizona State University (ASU) and Deca Technologies (Deca), a premier provider of advanced wafer- and panel-level packaging technology, today ...