Fan-Out Wafer Level Packaging (FOWLP) has been established as one of the most versatile packaging technologies in the recent past and already accounts for a market value of over 1 billion USD due to ...

From thinning and trimming to bonding and debonding, 3D package quality is built on precise and extremely thin wafer ...

MOUNTAIN VIEW, Calif., Aug. 25, 2020 -- Synopsys, Inc. (Nasdaq: SNPS) today announced that Synopsys and TSMC have collaborated to deliver certified design flows for advanced packaging solutions using ...