NEW YORK, June 19, 2024 /PRNewswire/ -- The global fan-out wafer level packaging market size is estimated to grow by USD 5.52 billion from 2024-2028, according to Technavio. The market ...

The YES RapidCure tool, based on an exclusive license to the process created by Deca Technologies, is a combination of UV and direct thermal exposure that significantly reduces process cycle ...

Fan-out panel-level packaging is poised to play a transformative role in the future of advanced semiconductor packaging. As technologies like AI, 5G, and high-performance computing demand greater ...

A new technical paper titled “Defect Analysis and Built-In-Self-Test for Chiplet Interconnects in Fan-out Wafer-Level Packaging” was published by researchers at Arizona State University. Abstract “Fan ...

TEMPE, Ariz., March 19, 2024 (GLOBE NEWSWIRE) -- Arizona State University (ASU) and Deca Technologies (Deca), a premier provider of advanced wafer- and panel-level packaging technology, today ...

FREMONT, CA / ACCESS Newswire / February 28, 2025 / Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced it has completed shipment of ...