But the Icepi Zero stands out for a few reasons. The biggest is that instead of an ARM or RISC-V based processor, it’s powered by a Lattice ECP5 FPGA, which means users can basically pick their own ...

The ECP5 FPGA Family launched by Lattice Semiconductor was specifically designed to focus on key fast growing and high-volume markets such as small-cells, microservers, broadband access, or industrial ...

Figure 1 depicts one corner of an FPGA package. The figure shows the balls on the bottom side of the FPGA as they would appear from underneath the package. You could never see this view in a real ...

At a glacial pace, FPGA development platforms are becoming ever more capable and less expensive. [Eric Brombaugh] has been playing around with both ARMs and FPGAs for a while now and decided to ...

optical I/O incorporated directly into the FPGA package. These new capabilities would result in entirely new application horizons for FPGAs. The use of chiplets in high-end semiconductor devices ...

The first step involves placing a stand-alone FPGA onto the same package as a Xeon processor. After that, the Xeon processor and the FPGA would be fused together onto a single piece of silicon.

Over 81% of new digital designs utilize Field Programmable Gate Arrays (FPGAs). With FPGA packages exceeding 1,000 pins, with Ball Grid Array (BGA) solder bumps providing the interconnect, it is ...

There was talk of hybrid CPU-FPGA packages, which never seem to get commercialized because no system architect likes static ratios of compute – unless they are determining the ratios. Like the ...

These are available from many different companies in different packages, but they all typically use the same DE10-Nano circuit board from Terasic. Other FPGA devices take the opposite approach.

The “USM Universal Submodule” concept is leading the way to a new generation of M-Modules and PMCs that implement the desired functionality through an IP core in an FPGA. With the help of a ...