The ECP5 FPGA Family launched by Lattice Semiconductor was specifically designed to focus on key fast growing and high-volume markets such as small-cells, microservers, broadband access, or industrial ...

The first step involves placing a stand-alone FPGA onto the same package as a Xeon processor. After that, the Xeon processor and the FPGA would be fused together onto a single piece of silicon.

optical I/O incorporated directly into the FPGA package. These new capabilities would result in entirely new application horizons for FPGAs. The use of chiplets in high-end semiconductor devices ...

Figure 1 depicts one corner of an FPGA package. The figure shows the balls on the bottom side of the FPGA as they would appear from underneath the package. You could never see this view in a real ...

Here we are in 2018, and the Arria 10 GX appears to still be the FPGA on the integrated package, but the Xeon portion has been upgraded to a “Skylake” generation. Here is what the chip package looks ...

Lattice has added a 132bga packaging option for its LatticeXP2 fpga range. Qualified for automotive use, the package will be targeted at space constrained applications such as camera modules, parking ...

He’s creating a version of the Raspberry Pi based on a chip that combines a fast ARM processor and an FPGA in one small package. It’s called the ZynqBerry and will, assuredly, become one of ...

Over 81% of new digital designs utilize Field Programmable Gate Arrays (FPGAs). With FPGA packages exceeding 1,000 pins, with Ball Grid Array (BGA) solder bumps providing the interconnect, it is ...

and will use the Lattice ICE FPGA devices. The components on the board are 0603 and QFN32 packages. [Luke] suggests a solder stencil, paste, and an oven, but these size components are hand ...

These are available from many different companies in different packages, but they all typically use the same DE10-Nano circuit board from Terasic. Other FPGA devices take the opposite approach.

The “USM Universal Submodule” concept is leading the way to a new generation of M-Modules and PMCs that implement the desired functionality through an IP core in an FPGA. With the help of a ...