The new FC and FCOM LED solutions include a middle power LED package (LM131A), a high power LED package (LH141A) and an LED downlight module, all featuring the new Samsung flip chip technology.

A recently developed software tool automatically checks for design-rule violations as locations are designated for wire bonds between die and package lead frames. Known as the Post-Layout Bond ...

Also, as the package is cut physically, other wire bonds may be disturbed. Because of this it is normally not practical to perform measurements with traditional techniques. The VersaXRM™ family of ...

A new technical paper titled “A Comparative Study on Various Au Wire Rinse Compositions and Their Effects on the Electronic Flame-Off Errors of Wire-Bonding Semiconductor Package” was published by ...

TOKYO--(BUSINESS WIRE)--Resonac Corporation (TOKYO:4004) (President: Hidehito Takahashi, hereinafter “Resonac”) has developed a temporary bonding film to be used for supporting a wafer on a ...

A new technical paper titled “ILP-Based Substrate Routing with Mismatched Via Dimension Consideration for Wire-bonding FBGA Package Design” was written by researchers at National Taiwan University of ...