As such, SiP incorporates flip chip (FC), wire bond (WB), and fan-out wafer- level packaging ... integration of various functional blocks such as wire bonding, Package-on- Package (PoP), 2.5D, 3D, ...
Before the advent of flip chips and solder ball techniques, wire bonding was the traditional interconnection method to and from the chip. See flip chip and chip package. THIS DEFINITION IS FOR ...
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