Figure 2: Cross-sectional view of a Quad-Flat Package (QFP) wire bond test setup using VTEP With this approach, the Electrical Structural Tester (EST) leverages advanced capacitive and inductive ...

TOKYO--(BUSINESS WIRE)--Resonac Corporation (TOKYO:4004) (President: Hidehito Takahashi, hereinafter “Resonac”) has developed a temporary bonding film to be used for supporting a wafer on a ...

A new technical paper titled “A Comparative Study on Various Au Wire Rinse Compositions and Their Effects on the Electronic Flame-Off Errors of Wire-Bonding Semiconductor Package” was published by ...