System-on-chip (SoC) and system-in-package (SiP) solutions offer benefits in terms of component count and complexity. Thus, it’s important for designers to understand the pros and cons of each ...

KYOCERA AVX offers extremely compact and high-performance on-board, multiprotocol, 2.4GHz antennas engineered to help customers satisfy challenging miniaturization, performance, and cost ...

Adding a single Apple Watch SiP to its US manufacturing may not seem like a big deal. But as Culpan points out, this is just the second chip Apple is producing at TSMC Arizona.

As IoT chips involve requirements for low power consumption, low cost and ready availability, SiP will be the main packaging technology applicable to chip solutions for IoT applications.

Many chips can be made on one silicon wafer. For example, thousands of the latest DRAM (dynamic-RAM) chips can be made on a single 12-inch (300-millimeter) wafer.

Sophisticated and expensive machinery used to make semiconductors, more widely-known as "chip-making tools", are in the news again, amid talks where the United States will urge Japanese and Dutch ...

The pledges are part of an enormous ramp-up in U.S. chip-making plans over the past 18 months, the scale of which has been likened to Cold War-era investments in the space race.