STMicroelectronics has released a set of antenna-matching companion chips for STM32WL33 wireless microcontrollers (MCUs) to ...

The MicroLeadFrame (MLF)/quad flat no lead (QFN) package, which is a Chip Scale Package (CSP) fabricated from one-layer leadframe, has been used in various applications for many years [5]. The MLF or ...

Laser frequency combs are light sources that produce evenly spaced, sharp lines across the spectrum, resembling the teeth of ...

STMicroelectronics has released a set of antenna-matching companion chips for STM32WL33 wireless microcontrollers (MCUs) to ...

May 29 /PRNewswire/ -- Underscoring its commitment to leading-edge assembly technology, Actel Corporation (Nasdaq: ACTL), a supplier of innovative programmable logic solutions, today announced the ...

As computing technology advances, we have shifted from using large, single-chip processors ... When we scale this approach to various chiplets, we create what's known as Network-in-Package ...

protection products available in the chip-scale package (CSP) format. These 4- and 16-channel devices are additions to the company's chip-scale ESD device featuring eight channels of protection.

The MSPM0C1104 is a wafer chip-scale package microcontroller (MCU) that is 38% smaller than existing alternatives, making it an ideal solution for applications where board space is at a premium ...

We see '25 as more of the same as [chip scale package capital spending] continues to rise and enterprises work to monetize ...