If you’ve ever wanted to open up an IC to see what’s inside it, you have a few options. The ceramic packages with a metal lid will succumb to a hobby knife.

In order to offer its customers a comprehensiv variety of solutions in the microelectronic area, Micronor broadens its product range by distributing ceramic packages of different types : Dual In Line ...

Power Integrations, a developer of high-voltage integrated circuits (ICs) for energy-efficient power conversion, has ...

Kyoto [japan], May 9 (ANI): Kyocera Corporation (President: Hideo Tanimoto) has announced that it has developed an ultra-small ceramic package utilizing a proprietary multilayer structure with a ...

SANTEE, Calif., February 25, 2025--StratEdge debuts advanced molded ceramic packages for next-gen high-power devices at IMAPS & GOMACTech 2025, featuring an updated MC Series datasheet.

Research into using glass substrates for chipmaking is nothing new. As Intel’s release says, the company has been working on this technology for at least a decade, as have other organizations ...

StratEdge offers post-fired ceramic, low-cost molded ceramic, ceramic QFN packages, and specializes in packages for extremely demanding gallium arsenide (GaAs) and gallium nitride (GaN) devices.

Power supply developer Enpirion (Bloomsbury, N.J.) is one step closer to packing a complete high-performance nonisolated dc-dc converter on a single semiconductor Power supply developer Enpirion ...