never worry about paint chips, shine those scratches right out. The hype might not be precisely true, but it hints at the practical basis of the concept. Long before $3000 ceramic packages made ...

base packages and its off-the-shelf line of molded ceramic packages that can be configured to meet the requirements for chips with frequencies up to 18 GHz. These packages provide enhanced thermal ...

The ceramic packages with a metal lid will succumb to ... don’t forget there is a thin layer of glass over almost the entire chip. This layer–the passivation–is relatively thick and usually ...

Reportedly, it provides a long field life, with none of the BGA wear out, die cracking, delamination, or flip chip bump fatigue of ceramic and other packages. Available as a single-chip module or ...

StratEdge’s molded ceramic packages accommodate devices operating at frequencies up to 18 GHz, making them ideal for a wide range of RF, microwave, and millimeter-wave applications. With over ...