The number of technology options continue to grow for advanced packaging, including new and different ways to incorporate so-called silicon bridges in products. For some time, Intel has offered a ...

The earlier the SiP-design experts engage with the system designers, the better the resulting design quality is likely to be.

A system in package, or SiP, is a way of bundling two or more ICs inside a single package. This is in contrast to a system on chip, or SoC, where the functions on those chips are integrated onto the ...

San Jose-based IC package and PCB signal, power and thermal integrity analysis tool supplier Optimal Corp. said today it has added chip-package-PCB co-design support to its system-in-package (SiP) ...

Driving Growth Through Miniaturization and 5G Propelling the System in Package (SiP) Die Market Rising demand for miniature, high-performance devices is fueling significant growth in the System in ...

New features in Allegro 16.6 Package Designer and Cadence ® SiP Layout include open cavity support for die placement, a new wirebond application mode that improves efficiency, and a wafer-level ...

Infineon Technologies has announced the launch of its CoolSET System in Package (SiP). CoolSET System in Package (SiP) Credit: Infineon A compact, fully integrated system power controller for highly ...