Using only a single-crystal piezoelectric thin wafer of lithium niobate (LN) instead of the usual two-part structure, a group ...

Mechanistic Interplay in SiCN Wafer Bonding for 3D Integration” was published by researchers at Yokohama National University, ...

Gallium nitride, a semiconductor renowned for its efficiency and high-speed capabilities, has long been recognized as a ...

Surface topography at the nanoscale is vital for material performance, impacting semiconductor processes and quality control ...

A novel power supply technology for 3D-integrated chips has been developed by employing a three-dimensionally stacked ...

Valuates Reports Logo. The Temporary Wafer Bonding Materials Market was estimated to be worth USD 269.58 Million in 2024 and is forecast to a readjusted size of USD 400.17 Million by 2031 with a ...

EV Group (EVG), a provider of semiconductor integration and process solutions, has topped the rankings in the 2025 ...

TSMC's advanced packaging tech and global expansion drive AI innovation and stock growth, despite geopolitical and capital ...

Resonac Corporation and PulseForge, Inc. are pleased to announce a strategic partnership to advance and promote photonic debonding technology for next-generation semiconductor packaging as of April, ...

A new 3D chip stacking method developed in Japan promises to revolutionize AI and high-performance computing with faster data ...