ASE Holdings, the world's largest outsourced semiconductor assembly and test (OSAT) provider, has transitioned its core IT ...

ASE has transitioned to AMD EPYC and Ryzen processors across its data centers and client systems, achieved major performance ...

Tunneling down a little deeper, the AMD Instinct MI300 features a 128-channel interface to its HBM3 memory, with each IO die connected to two stacks of HBM3. The MI300s also feature 256MB of AMD ...

The AMD Data Center & AI Technology Premiere Event was the introduction of a new variant of its Instinct ... MI-300 with three CDNA3 GPU chiplets and one Genoa Zen-4 based Core Complex Die ...

A close-up shot at the AMD Instinct MI300's chiplet package The ... According to Su, the Instinct 300 will ship in the second half of this year.

The upcoming MI300, which will ship Latter this year after NVIDIA’s Grace/Hopper Superchip, certainly has a shot at it ... Lots of Software. AMD Instinct MI300 is a combination of its flagship ...

doubling MI300’s density Multimedia IO Die offloads IO tasks and may integrate Xilinx FPGA tech AMD’s Instinct MI400 APU is set to arrive in 2026 - designed for AI, machine learning ...

“With the adoption of AMD Instinct MI300X accelerators and ROCm open software for these latest deployments, Vultr’s customers will benefit from having a truly optimized system tasked to manage ...

The MI400 series also introduces a dedicated Multimedia I/O Die (MID) to enhance data throughput and processing efficiency. AMD's official roadmap indicates plans to launch the Instinct MI355X AI ...

A family of AI chips from AMD. Introduced in 2023, the Instinct MI300X is a GPU chip with 192GB of HBM3 memory. Multiple MI300X chips are used in AMD's Infinity Architecture Platform for high-end ...

It's called the AMD Instinct MI300, and it packs a whopping ... The CPU and GPU chiplets are 3D-stacked on top of a base die that connects them to the eight stacks of HBM. The design uses nine ...