TSMC's CoWoS capacity expansion is expected to double again in 2025; commentary on plant progress would be a key focus point in Q4 FY24's earnings call. The next couple of quarters may see further ...

TSMC is planning to build two new CoWoS facilities at the Phase III site of Southern Taiwan Science Park (STSP), in an investment worth in excess of NTD 200 billion. According to a report from the ...

Nvidia's (NASDAQ:NVDA) latest Blackwell lineup suggests it will reduce demand for CoWoS-S from Taiwan Semiconductor Manufacturing Company (NYSE:TSM) for at least the next year based on design ...

【野村证券： 英伟达 多项产品需求放缓 预估每年减少5万片CoWoS-S需求】《科创板日报》15日讯，日前传出英伟达砍单 台积电 CoWoS消息，但供应链 ...

TSMC has maintained its equipment orders, despite market rumors regarding a decrease in demand for Chip-on-Wafer-on-Substrate (CoWoS) packaging from Nvidia. According to sources at semiconductor ...

TL;DR: NVIDIA is shifting from CoWoS-S to CoWoS-L advanced packaging for its Blackwell AI GPUs, requiring increased capacity from TSMC, the leader in semiconductor technology. This transition aims ...

Specifically, Nvidia is transitioning from CoWoS-S to CoWoS-L, representing a significant advancement in its chip architecture as well as a major shift for TSMC. Speaking on the sidelines of an ...

【郭明錤：英伟达更新Blackwell架构产品线 CoWoS-S需求削减主要源于产品线更新而非需求下滑】《科创板日报》15日讯，知名分析师郭明錤今日发文 ...

As Nvidia ramps up production of its multi-chiplet Blackwell-series products, the company will use more CoWoS-L packaging capacity and less CoWoS-S packaging capacity, the company's chief ...

The revised road plan presents the 200 Series, which employs dual-die design produced using CoWoS-L technology. Systems in the 300 Series include single-die (CoWoS-S) and dual-die (CoWoS-L).